SKN 22,4 Qu bond

Chips

VRRM / VDRM in V 1600
IF / IT in A 770
IFSM / ITSM in A 9450
Technology Rectifier

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SEMIKRON
SEMIKRON SKN

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SKN 22,4 Qu bond Features

  • high current density due to mesa technology
  • high surge current
  • compatible to thick wire bonding
  • compatible to all standard solder processes

SKN 22,4 Qu bond Target Applications

  • uncontrolled rectifier bridges

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