Semikron Danfoss at PCIM Europe 2024
11 - 13 June 2024
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You can find us at
Hall 7, Booth 7-459
Exhibition Centre Nuremberg
Messeplatz 1
90471 Nuremberg
Germany
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The Ultimate Partner in Power Electronics
Semikron Danfoss is a global technology leader in power electronics, established in August 2022 when SEMIKRON and Danfoss Silicon Power joined forces. In a world that is going electric, our innovative solutions enables the green transition by decarbonizing with our customers in Industry, e-Mobility and Renewables.
We’re excited to showcase the strongest product portfolio in the industry at PCIM Europe. Come meet our experts in hall 7 at booth 7-459 and see how our solutions can strengthen your product. You can get a preview of what we will present here.
Our PCIM 2024 Highlights
Our PCIM 2024 Product Showcases
SKAI® HV
Compact Power Converters for E-Mobility
SKAI® LV
Ultra-Compact MOSFET Inverter PlatformOur PCIM 2024 Stage Presentations
First SiC IPM for 1500VDC-Link Voltage
Anastasia Schiller
11 June 2024, 15:00 - 15:20
E-Mobility & Energy Storage Stage
The new SKiiP 4 SiC IPM with 2kV SiC devices enables safe operation of 1500V applications thanks to an integrated driver, current sensing, and protection functions. The SKiiP includes an air- or water-cooled heatsink and is 100% tested. The digital driver enables the use of multiple SiC MOSFET suppliers, and the current rating is adjustable based on the quantity of chips in parallel. The high-power stack platform, SEMISTACK RE, will also be available with the new SKiiP 4 SiC, further reducing development time and effort. With the new SKiiP 4 SiC, 1500V converter designs are now simpler, keeping CAPEX and OPEX to a minimum.
Increase Power Density & Design Simplicity for 1500V Applications with 2kV SiC
Emiliano Meza
12 June 2024, 15:00 - 15:20
E-Mobility & Energy Storage Stage
Thanks to new 2kV SiC technology, the SEMITRANS 20 boosts the power density of power electronics compared to 3-level silicon solutions. The SEMITRANS 20 has an optimized construction for scaling to even higher power levels through paralleling, while the traction-derived packaging technologies offer unparalleled reliability. A high blocking voltage capability offers safety for 2-level converters operating at 1500V, simplifying converter design.
More Compact and Efficient Motor Drives with Silicon Carbide Power Modules
Carsten Schreiter
12 June 2024, 10:00 - 10:20
Exhibitor Stage
Motor drives and silicon carbide MOSFETS are two topics that, for a long time, seemed impossible to combine. High costs, fast switching transitions, lack of short circuit capability, and reliability concerns were all persistent roadblocks, but it is time to rethink. With recent technological advancements and a tangible return on investment, silicon carbide is becoming the first choice for enabling higher energy savings and increasing power density in motor drives. By merging state of the art packaging technology with the latest generation of SiC MOSFTEs, we provide a totally new degree of design freedom to engineers.
Strong Partnerships in Power Electronics – Why They Matter
Carsten Schreiter
Exhibitor Stage
The supply challenges in semiconductors we experienced in the past years appear to be over – but for how long? Undoubtedly, decarbonization efforts by countries and industries must continue, driving an even higher demand for power semiconductors. Additionally, geopolitical uncertainties stress supply chains more and more. Mastering future scenarios requires sustainable supply strategies with multiple sourcing as a key element. Being chip independent, Semikron Danfoss has always had strong partnerships with multiple chip manufacturers. These partnerships enable valuable options for the implementation of such multiple sourcing strategies. ROHM Semiconductor has been a trusted partner to Semikron Danfoss for years. This strong partnership essentially shows vertical integration in the supply chain. It allows us to provide powerful alternative sourcing possibilities to the popular Generation 7 IGBTs but also energy efficient options for future designs with SiC.
Conference Contributions & Dialogue Sessions
| Topic | Speaker | Date & Time | Location |
|---|---|---|---|
| An Innovative 3-level Solution for Automotive Application | Pranav Panchal | June 12, 24 10:30 | Brüssel 1 |
| Investigation of Inorganic Encapsulation Materials in Power Electronic Systems for High Power Density Applications | Stefan Behrendt | June 12, 24 11:10 | Brüssel 2 |
| Poster Session: Influence of Transfer Molding on the Reliability of DCM SiC Power Modules | Jacek Rudzki | June 12, 24 | D03 - 9WNB5N8XWZ |
| The Design of a 2kV 1700A SiC MOSFET Dual Module | Jorge Mari | June 13, 24 14:00 | Brüssel 1 |