Semikron Danfoss at PCIM Europe 2024

11 - 13 June 2024

You can find us at

Hall 7, Booth 7-459
Exhibition Centre Nuremberg
Messeplatz 1
90471 Nuremberg
Germany

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The Ultimate Partner in Power Electronics

Semikron Danfoss is a global technology leader in power electronics, established in August 2022 when SEMIKRON and Danfoss Silicon Power joined forces. In a world that is going electric, our innovative solutions enables the green transition by decarbonizing with our customers in Industry, e-Mobility and Renewables.

We’re excited to showcase the strongest product portfolio in the industry at PCIM Europe. Come meet our experts in hall 7 at booth 7-459 and see how our solutions can strengthen your product. You can get a preview of what we will present here.

Meet us at PCIm 2023

Our PCIM 2024 Highlights

It's Your Choice

Innovative packages that push the limits of SiC

Semikron Danfoss introduces the SEMITRANS 20 and SKiiP 4 SiC, equipped with 2kV SiC chips from multiple sources. The SEMITRANS 20 enables flexible converter development, while the SKiiP 4 SiC integrates power modules, driver, current sensors, and heatsink.

Whether you prefer a standard package or a ready-to-use IPM solution, it’s your choice.

SEMITRANS® 20

Industry Standard Power Module for Extreme Power Density

    • with 2kV SiC
    • 500kW up to 2MW

IPM SKiiP® 4 SiC

Reduced Time-to-Profit

    • with 2kV SiC
    • 500kW up to 2MW

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You’re Covered

With highly scalable solutions addressing key power ratings

Semikron Danfoss offers more than 20 years of experience and know how in E-Mobility applications. With the merger of two technology leading companies we have the possibility to offer the multiple advantages of our combined technologies. With our two power module platforms, eMPack and DCM, we offer highly scalable solutions for passenger car and commercial vehicle inverter applications from 100kW to 750kW.

DCMTM

  • 350A up to 900A
  • Scalable across voltage classes

eMPack®

  • 100kW up to 750kW
  • High efficiency SiC technology

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Our PCIM 2024 Product Showcases

 

 

SEMITRANS® 20

The next generation standard power module

The SEMITRANS 20 product family increases product lifetime and power output. Multiple chip sources provide the highest supply chain safety. SEMITRANS 20 modules deliver significant advantages on the high-power inverter market:

  • A simplified inverter design leads to reduced costs for mounting materials as well as in the inverter assembly process
  • Sintered die attachment provides high-end reliability
  • More space for driver boards and less magnetic field disturbance from high current bus bars to the driver
  • Three AC terminal connectors for low operating temperatures even at high loads
  • Less derating at parallel operation thanks to the low-inductance bus bar layout and the extremely low module inductance
  • Ideal for cost-effective inverter design and scaling

 On top of this, the SEMITRANS 20 TRACTION module provides additional innovative technologies such as AlCu wire bonds, Si3N4 ceramics and AlSiC baseplate. This takes reliability and power density to new levels, resulting in:

  • Superior product lifetime
  • Lower cost per kW
  • Smaller volume per kW

Multiple Sourcing

Power Modules with ROHM 1200V RGA IGBTs

A True Alternative to Generation 7 IGBTs for Industrial Motor Drives

The worldwide growth in electrification technologies has created unprecedented demand for power modules. The chip supply often limits power module availability, and the sourcing situation remains tight. For this reason, Semikron Danfoss has partnered with ROHM to supply their new 1200V RGA IGBT. With a line-up of industry standard housings, there is now a true alternative to Generation 7 IGBT power modules.

Key Features

  • Newly designed 1200V, trench gate, light punch through IGBT with Tj,max = 175°C
  • Optimized for industrial drive applications in the low to medium power range
  • High peak current capability
  • Humidity-robust
  • Low thermal resistance
  • True multiple source alternative to Generation 7 IGBT equipped power modules

SKAI® HV

Compact Power Converters for E-Mobility

SKAI HV comprises a versatile 3-phase converter platform designed for use in electrified vehicles. It covers key requirements such as high power density, exceptional ruggedness and automotive EMI compliance. The integrated motor control software SKAIware ensures highly efficient operation of the electric drive train.

Short Facts

  • Suitable for battery voltages up to 800VDC
  • Sintered power semiconductors
  • EMI compliant
  • Peak current 400Arms
  • Peak apparent power 300kVA

Product Features

  • Compact integration into IP67 enclosure
  • Voltage, current and temperature sensors
  • Gate driver with protection
  • IGBT power semiconductors
  • Fully programmable digital signal processor
  • EMI filters
  • Versatile cooling system (liquid-cooled, forced-air cooled, base plate)
  • DC-link capacitors
  • Motor control software

SKAI® LV

Ultra-Compact MOSFET Inverter Platform

The SKAI LV is a platform for low-voltage inverter systems for on and off-road applications. This platform constitutes the 3rd generation of low-voltage inverter systems and the 7th generation of MOSFET inverter technology developed by Semikron Danfoss, with more than 1.5 million MOSFET inverters in the field.

To create an optimized application-specific motor control system, simply integrate a customized control board. The SKAI LV platform is based on the same power technology found in high-voltage, high-reliability applications today, providing access to high-power, maximum reliability technologies across a wide range of low-voltage on and off-road applications.

Low-voltage MOSFET inverter system up to120V and 55kVA

  • For material handling and battery powered vehicles
  • Voltage, current and temperature sensors
  • Gate driver with protection
  • Low inductance, low-loss power section
  • DC link capacitors
  • Air and plate cooling
  • Easy-to-use gate driver interface
  • Platform for customised designs

Product Features

  • For compact designs
  • 30kVA/l power density
  • Vbattery: 24VDC up to 96VDC
  • 600Arms peak current during acceleration
  • Easy-to-use gate driver
  • IP66 enclosure


Our PCIM 2024 Stage Presentations

First SiC IPM for 1500VDC-Link Voltage

Anastasia Schiller
11 June 2024, 15:00 - 15:20
E-Mobility & Energy Storage Stage

The new SKiiP 4 SiC IPM with 2kV SiC devices enables safe operation of 1500V applications thanks to an integrated driver, current sensing, and protection functions. The SKiiP includes an air- or water-cooled heatsink and is 100% tested. The digital driver enables the use of multiple SiC MOSFET suppliers, and the current rating is adjustable based on the quantity of chips in parallel. The high-power stack platform, SEMISTACK RE, will also be available with the new SKiiP 4 SiC, further reducing development time and effort. With the new SKiiP 4 SiC, 1500V converter designs are now simpler, keeping CAPEX and OPEX to a minimum.

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Increase Power Density & Design Simplicity for 1500V Applications with 2kV SiC

Emiliano Meza
12 June 2024, 15:00 - 15:20
E-Mobility & Energy Storage Stage

Thanks to new 2kV SiC technology, the SEMITRANS 20 boosts the power density of power electronics compared to 3-level silicon solutions. The SEMITRANS 20 has an optimized construction for scaling to even higher power levels through paralleling, while the traction-derived packaging technologies offer unparalleled reliability. A high blocking voltage capability offers safety for 2-level converters operating at 1500V, simplifying converter design.

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More Compact and Efficient Motor Drives with Silicon Carbide Power Modules

Carsten Schreiter
12 June 2024, 10:00 - 10:20
Exhibitor Stage

Motor drives and silicon carbide MOSFETS are two topics that, for a long time, seemed impossible to combine. High costs, fast switching transitions, lack of short circuit capability, and reliability concerns were all persistent roadblocks, but it is time to rethink. With recent technological advancements and a tangible return on investment, silicon carbide is becoming the first choice for enabling higher energy savings and increasing power density in motor drives. By merging state of the art packaging technology with the latest generation of SiC MOSFTEs, we provide a totally new degree of design freedom to engineers.

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Strong Partnerships in Power Electronics – Why They Matter

Carsten Schreiter

Exhibitor Stage

The supply challenges in semiconductors we experienced in the past years appear to be over – but for how long? Undoubtedly, decarbonization efforts by countries and industries must continue, driving an even higher demand for power semiconductors. Additionally, geopolitical uncertainties stress supply chains more and more. Mastering future scenarios requires sustainable supply strategies with multiple sourcing as a key element. Being chip independent, Semikron Danfoss has always had strong partnerships with multiple chip manufacturers. These partnerships enable valuable options for the implementation of such multiple sourcing strategies. ROHM Semiconductor has been a trusted partner to Semikron Danfoss for years. This strong partnership essentially shows vertical integration in the supply chain. It allows us to provide powerful alternative sourcing possibilities to the popular Generation 7 IGBTs but also energy efficient options for future designs with SiC.

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Conference Contributions & Dialogue Sessions


Topic SpeakerDate & Time Location
An Innovative 3-level Solution for Automotive ApplicationPranav PanchalJune 12, 24
10:30
Brüssel 1
Investigation of Inorganic Encapsulation Materials in Power Electronic Systems for High Power Density Applications Stefan BehrendtJune 12, 24
11:10
Brüssel 2
Poster Session: Influence of Transfer Molding on the Reliability of DCM SiC Power ModulesJacek RudzkiJune 12, 24 D03 - 9WNB5N8XWZ
The Design of a 2kV 1700A SiC MOSFET Dual ModuleJorge MariJune 13, 24
14:00
Brüssel 1