MiniSKiiP®
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MiniSKiiP®的优势
随着最新IGBT 7芯片的问世,MiniSKiiP芯片再次为中低功率电机 驱动的功率密度和性能设定了新标准。结合MiniSKiiP SPRiNG弹 簧连接技术众所周知的优点和简易的组装过程,新的性能基准已 经建立。
与需要昂贵的焊接设备和耗时的焊接工艺的传统焊接模块相比, 由于MiniSKiiP仅采用一个或两个螺丝进行连接,不需要专用的工 具进行组装。印刷电路板(PCB)、功率模块和散热器组装可一步 完成。
采用全新IGBT 7芯片技术的功率密度大师
MiniSKiiP®生产过程
MiniSKiiP® Short Facts
- MiniSKiiP in 6 different housings
- Low-cost assembly, high production run rate, high yield
- Small and compact system designs
- Excellent reliability and long product life time
- Up to 110kW Motor Drive power, 250kW Solar inverter power and 100kVA UPS power
MiniSKiiP®的关键特性
- 电流范围4A至400A,单一产品平台即可令逆变器功率达到110kW
- 全面的拓扑结构配置:CIB、三相全桥、双三相全桥、H桥、半桥、三电平、带制动斩波器的整流桥
- 免焊接SPRiNG弹簧连接技术,仅用一到两个螺丝安装,将组装时间缩至更短
MiniSKiiP®的应用
应用 凭借20多年的经验和多达4500万件的现场应用量,MiniSKiiP平台 已在各类标准应用中获得成功,主要应用包括电机驱动器、伺服驱 动器、太阳能逆变器、UPS系统和焊接机。
MiniSKiiP®IGBT模块
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MiniSKiiP®全碳化硅功率模块
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MiniSKiiP®桥式整流器模块
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