MiniSKiiP®

Scalable without Compromise

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MiniSKiiP® Benefits

The unique mechanical feature of MiniSKiiP modules is the outstandingly easy assembly and service friendly spring contact technology. Compared to conventional solder or press-fit modules, where specific equipment (automated presses, wave soldering machine) is required, no dedicated tools are needed for MiniSKiiP assembly. Instead, a single or a two screw connection is used.

The printed circuit board (PCB), the power module and the heat sink are assembled in one mounting step. This connection technology features a number of additional advantages: the PCB can be more flexible in design, as the printed circuit board does not need to include holes for solder pins or pressfit connections. The springs provide a flexible connection between the PCB and the power circuitry which is far superior to a soldered joint, particularly under thermal or mechanical stress conditions which can affect lifetime. Thanks to the high mechanical pressure provided by the springs, an air-tight, reliable electrical connection is achieved.

MiniSKiiP® with IGBT 7

MiniSKiiP® Production Process

MiniSKiiP® Short Facts

  • MiniSKiiP in 6 different housings
  • Low-cost assembly, high production run rate, high yield
  • Small and compact system designs
  • Excellent reliability and long product life time
  • Up to 110kW Motor Drive power, 250kW Solar inverter power and 100kVA UPS power

MiniSKiiP® Key Features

  • Solder-free SPRiNG technology for fast and easy assembly
  • Without copper baseplate for cost efficient designs and high thermal performance
  • Easy and flexible PCB routing without pin holes
  • Comprehensive setup of topologies: CIB, Sixpack, Twelvepacks, H-bridge, Half-Bridge, 3-level NPC/TNPC/ANPC,  boost topologies (boost chopper, Flying Capacitor Boost, Symmetrical Boost), bridge rectifiers

MiniSKiiP® Applications

With two decades of field experience and more than 45 million modules in the field, this module platform has proven successful in all standard applications. Key applications include all kinds of inverters, such as motor and servo drives, solar inverters with 1000VDC and 1500VDC, UPS systems and welding machines. Thanks to the excellent reliability of spring contacts, applications such as agricultural vehicles or yaw and pitch drives in wind turbines benefit from MiniSKiiP technology as well.

MiniSKiiP® Product Range

MiniSKiiP modules are designed for 600V/650V, 950V, 1200V and 1700V with 4A - 600A nominal chip currents. Beside the consolidated IGBT3 and IGBT4, also the latest IGBT Generation 7 and Silicon Carbide components are implemented.

In addition to the standard motor drive topologies CIB, sixpack, twelvepack, half-bridge and the accompanying un-/half- and full-controlled rectifiers and choppers also solar and UPS specific topologies are available. A full range of NPC, TNPC and ANPC topologies along symmetrical and flying capacitor boost, all based on the latest 950V IGBT Generation 7 chipsets, enable highest power density in string solar inverters. NPC and symmetrical boost topologies based on fast-switching 650V IGBT and diodes enable UPS systems of up to 100kVA with highest power density as well. What’s more, the latest chip technology such as full and hybrid silicon carbide power modules push the efficiency and power density to even higher levels. For fast evaluation, test PCB boards can be ordered for the most of the power modules. On top of that, all power modules are also available with pre-applied High Performance Thermal Paste, a benchmark thermal interface material.

MiniSKiiP product range
MiniSKiiP in six different housings

MiniSKiiP® IGBT Modules

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MiniSKiiP® Full SiC Modules

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MiniSKiiP® Bridge Rectifier Modules

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Our Solution for Motor Drives

The latest IGBT T7 chip generation:

  • 20% lower forward voltage drop (Vce,sat) compared to IGBT 4
  • 25% smaller chip size compared to IGBT 4

Example housing size jump: 50A CIB module in 35% smaller package

In the motor drive application:

  • Up to 20% lower losses at the same output power, or up to 20% higher output power

Higher efficiency, increased power density and lower system cost

The Power Density Master utilizing the new IGBT 7 chip technology

Scalable without compromise

CB and heatsink can be mounted in one easy step
  • One inverter design concept from 1 to 110kW, 100% PCB based: minimum assembly time with solder free SPRiNG technology; module, PCB and heatsink can be mounted in one easy step
  • Easy and flexible PCB routing without pin holes
  • Available with pre-applied high performance thermal paste for maximum output power

Example:

Complete motor drive design based on MiniSKiiP
  • 110kW inverter design replacing copper bus bars with high power PCBs
  • Based on the Power Density Master features: IGBT T7, Silicon Nitride and High Performance Thermal Paste
  • System cost savings of up to 18% with fewer materials used than in baseplate module solutions
  • Same module sizes and contact technologies for all the components