Intelligent Power Module (IPM) with integrated driver and heat sink (SKiiP 4) enables an increase in power of 17% over the previous generation from 1.4 to 1.7MVA and offers the highest power density in the market

SEMIKRON, one of the leading manufacturers of power electronic components worldwide, upgrades SEMISTACK_RE, an IPM for renewable energy (RE). The new high-power converter for use in renewable energy applications such as wind and solar power installations will typically be used in synchronous and double-fed induction generators (DFIG) in wind turbines, as well as in central solar PV inverters.  

SEMISTACK_RE is a water-cooled 3-phase converter that comes in B6CI 2-quadrant or 2 x B6CI 4-quadrant configurations in a book-case-type mechanical design. Up to four SEMISTACK_RE converters can be connected in parallel and support applications of up to 6MVA. The SEMISTACK_RE range is based on SKiiP 4, the latest generation of SEMIKRON's SKiiP intelligent power module family which integrates power components, driver and heat sink in a single case.  

The previous version of SEMISTACK-RE based on the 3 bay version of SKiiP 3 has a current capability of 1,200A per module. The bigger 4-bay SKiiP 4 version has a current rating of between 1,000A and 1,400A. Thus, the maximum power carrying capacity of the SEMISTACK_RE converter increases by 17% to 1,7MVA. Thanks to the very low inductance planar DC busbar of the SEMISTACK_RE and the internal bus bar construction of the SKiiP 4 the nominal DC voltage can be extended up to 1250Vdc even in short circuit conditions.  

The integrated new digital gate driver of SKiiP 4 provides a safe electrical isolation between primary and secondary side for all switching or control signals and even for the temperature signal. This allows to omit expensive circuits for electrical isolation for the user. The SKiiP driver features a CANopen setup and diagnosis channel – a first in a power module – which enables access to an error memory, meaning errors in the SKiiP 4 can be quickly identified and saved for later diagnosis.  

Owing to its 100% solder free sintering process and innovative pressure contact system the thermal cycling capability of the SKiiP 4 is increased by a factor of 5 and the maximum junction temperature is raised to 175°C. These SKiiP 4 upgrades are coupled with long lifetime polypropylene capacitors to ensure highest reliability.    

Figures on request: The new SEMISTACK_RE enables an increase in power of 17% over the previous generation from 1.4 to 1.7MVA.    


SEMIKRON is a leading global power semiconductor manufacturer. The German-based family enterprise employs 3900 people worldwide. A global network of 36 companies with production plants in Brazil, China, France, Germany, India, Italy, Korea, Slovakia, South Africa and USA guarantees fast and competent on-site customer care.

SEMIKRON is a one-stop provider of chips, discrete semiconductors, transistor, diode and thyristor power modules, power assemblies and systems for markets such as industrial drives, wind and solar, hybrid and electric vehicles, the rail industry and power supply systems.

SEMIKRON is the market leader in the field of diode/thyristor semiconductor modules, enjoying a 30% share of the worldwide market. (Source: IMS Research, The World Market for Power Semiconductor Discretes & Modules – 2011 Edition). Our dedication to the hybrid and electric vehicle market is evident in the development and production of power semiconductors for this market, as well as in the majority take-over of Compact Dynamics GmbH, a development specialist for innovative control systems, the joint venture with drivetek, a provider for application-specific control technology, and the take-over of VePOINT, developing and producing inverters, DC/DC converters and chargers.

Recently, SEMIKRON introduced a revolutionary packaging technology for power semiconductors which does away with bond wires, solders and thermal paste. The new SKiN Technology is based on the use of a flexible foil and sintered connections rather than bond wires, solders and thermal paste. This results in a higher current carrying capacity and 10 times the load cycle capability – unthinkable with the restrictive wire bonding used in power electronics in the past. This enables a reduction in converter volume by 35%. This reliable and space-saving technology is the optimum solution for vehicle and wind power applications.