The latest IGBT chip technology

The generation 7 IGBTs represent the latest IGBT chip technology. This new generation is specifically designed to match the requirements of motor drive applications. The IGBTs come with a significantly lower forward voltage drop and deliver optimised switching performance. Thanks to roughly 25% smaller chips, higher nominal currents can fit into existing power module packages.

In application, the IGBT 7 provides reduced power losses or increased maximum output power and power density. This translates into lower system costs. As to motor drives, the generation 7 IGBT will initially be introduced into conventional drive topologies: CIB (Converter-Inverter-Brake), sixpack and half-bridge configurations. For low and medium power drives, MiniSKiiP and SEMITOP E1/E2 are the first available choice. For higher power classes IGBT 7 is available in SEMiX 3 press-fit and SEMiX 6 press-fit. More power modules are to follow.

For low and medium power drives

MiniSKiiP®

MiniSKiiP, the Power Density Master, reaches new levels utilizing the latest generation IGBT 7 chips and proven SEMIKRON packaging technologies.

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SEMITOP® E1/E2

SEMITOP E1/E2 is a 12-mm-high module platform with two lateral mounting screws, press-fit pins and no baseplate.

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For higher power classes

SEMiX® 3 Press-Fit

The concept of SEMiX 3 Press-Fit is a 17mm height module. Press-fit contacts allow for a gate driver mounted directly on top of the module.

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SEMiX® 6

SEMiX 6 features state-of-the-art press-fit pin technology for the power and auxiliary terminals.

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Product specifications/features

  • Optimized IGBTs for motor drive applications
  • Reduced saturation voltage and chip size
  • Higher nominal currents
  • Up to 45% more module output power
  • Lower overall system costs