Semikron Danfoss at PCIM Europe 2024

The transition from full vehicle platforms to full battery electric vehicle architectures is progressing rapidly. These architectures will require scalable power electronics solutions for electric drive systems (EDS) that are capable of covering a wide power range and are cost-effective at the same time, resulting in an important competitive advantage for vehicle manufacturers.

Semikron Danfoss' new power module platform eMPack, which is based on a common module concept, is being developed for EDS inverter architectures covering a power range from 100kW to 750kW. eMPack covers 400V and 800V battery system applications.

The combination of silicon carbide technology and Semikron Danfoss' fully sintered, low stray inductance Direct Pressed Die Technology (DPD) allows for unmatched power densities combined with high reliability for automotive applications.

Product Features

• High-efficiency SiC technology
• Ultra-low stray inductance
• Superior reliability in a fully sintered package
• Dedicated configurations for all BEV power ranges
• Compact package

To power up the fast-growing fleet of PHEVs and BEVs, Semikron Danfoss has developed a power module technology platform for traction applications — DCM™.

The DCM™ technology platform is designed to be scalable. In the same package, we can scale the power up or down to meet different inverter voltage classes with blocking voltages of 750V-1200V, power of 150kW to 500kW with output currents ranging from 350 to 900A.

Furthermore, our power modules are based on quality components, patented packaging and cooling technologies to achieve outstanding, measurable results in terms of reliable performance and robustness – all adding up to deliver a cost-effective solution that lasts.

Product Features

• Excellent flexibility in design, customized interfaces
• Si IGBT and full silicon carbide MOSFET technology
• Scalable across voltage classes
• Advanced bonding technologies for superior power cycling robustness
• High power density
• Robust molded module packaging
• Direct liquid cooling with ShowerPower^® 3D
• Multisourcing thanks to chip independency

SKAI HV comprises a versatile 3-phase converter platform designed for use in electrified vehicles. It covers key requirements such as high power density, exceptional ruggedness and automotive EMI compliance. The integrated motor control software SKAIware ensures highly efficient operation of the electric drive train.

Short Facts

• Suitable for battery voltages up to 800V_DC
• Sintered power semiconductors
• EMI compliant
• Peak current 400A_rms
• Peak apparent power 300kVA

Product Features

• Compact integration into IP67 enclosure
• Voltage, current and temperature sensors
• Gate driver with protection
• IGBT power semiconductors
• Fully programmable digital signal processor
• EMI filters
• Versatile cooling system (liquid-cooled, forced-air cooled, base plate)
• DC-link capacitors
• Motor control software

The SKAI LV is a platform for low-voltage inverter systems for on and off-road applications. This platform constitutes the 3rd generation of low-voltage inverter systems and the 7th generation of MOSFET inverter technology developed by Semikron Danfoss, with more than 1.5 million MOSFET inverters in the field.

To create an optimized application-specific motor control system, simply integrate a customized control board. The SKAI LV platform is based on the same power technology found in high-voltage, high-reliability applications today, providing access to high-power, maximum reliability technologies across a wide range of low-voltage on and off-road applications.

Low-voltage MOSFET inverter system up to120V and 55kVA

• For material handling and battery powered vehicles
• Voltage, current and temperature sensors
• Gate driver with protection
• Low inductance, low-loss power section
• DC link capacitors
• Air and plate cooling
• Easy-to-use gate driver interface
• Platform for customised designs

Product Features

• For compact designs
• 30kVA/l power density
• V_battery: 24V_DC up to 96V_DC
• 600A_rms peak current during acceleration
• Easy-to-use gate driver
• IP66 enclosure

Baseplate-less modules have gained popularity in numerous power electronic applications. The new SEMITOP E3 is a seamless extension of our baseplate-less SEMITOP E product line and comes with the latest Generation 7 IGBT chips. It scales up the proven performance of SEMITOP E1/E2 to higher power motor drive designs, while still utilizing a printed circuit board for all electrical connections. The SEMITOP E3 is a fully compatible, 12mm-tall, industry standard package. With press-fit pins and pre-applied TIM, the SEMITOP E3 is a smart choice for a flexible, multiple source motor drive design.

Product Features

• Baseplate-less design
• Scalable PCB-based design concept for motor drives of up to 55kW
• Industry standard footprint and pinout
• Flexible pin grid for additional topologies
• Optimised Press-fit pins (solder capable) for easier press-in/out
• Available with pre-applied TIM

Product Offering

SEMITOP E3 power modules will be offered with converter-inverter-brake (CIB) and sixpack topologies for the 1200V class.

CIB configurations (“DGDL”) will be provided in 50A, 75A, and 100A nominal current ratings, allowing the design of compact drives of up to 30kW/400VAC using a single power module.

Sixpack configurations (“GD”) will be available with 100A, 150A, and 200A nominal current. With these packages, a PCB-based drive design can be scaled up to as high as 55kW/400V_AC.

As with the SEMITOP E1/E2, SEMITOP E3 is available with pre-applied High Performance Thermal Paste (HPTP). Alternatively, for ease-of-handling during assembly, it also comes with pre-applied HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material.