The latest IGBT chip technology
The generation 7 IGBTs represent the latest IGBT chip technology. This new generation is specifically designed to match the requirements of motor drive applications. The IGBTs come with a significantly lower forward voltage drop and deliver optimised switching performance. Thanks to roughly 25% smaller chips, higher nominal currents can fit into existing power module packages.
In application, the IGBT 7 provides reduced power losses or increased maximum output power and power density. This translates into lower system costs. As to motor drives, the generation 7 IGBT will initially be introduced into conventional drive topologies: CIB (Converter-Inverter-Brake), sixpack and half-bridge configurations. For low and medium power drives, MiniSKiiP and SEMITOP E1/E2 are the first available choice. For higher power classes IGBT 7 is available in SEMiX 3 press-fit and SEMiX 6 press-fit. More power modules are to follow.
For low and medium power drives
MiniSKiiP, the Power Density Master, reaches new levels utilizing the latest generation IGBT 7 chips and proven SEMIKRON packaging technologies.
SEMITOP E1/E2 is a 12-mm-high module platform with two lateral mounting screws, press-fit pins and no baseplate.
For higher power classes
- Optimized IGBTs for motor drive applications
- Reduced saturation voltage and chip size
- Higher nominal currents
- Up to 45% more module output power
- Lower overall system costs