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Supply chain safety, exceeding the standard

Ensuring the highest supply chain safety to the customer is one of the main targets for SEMIKRON. The development and release of industry standard packages as well as the introduction of new IGBT chip sources reflect that strategy. Beside the Infineon and Fuji chips also Vishay, ABB and Renesas IGBT chips are available in 650V, 1200V and 1700V.

Thanks to thermal and switching performance optimisations in the standard packages and the integration of additional functionality such as AC current measurement shunts in the modules SEMIKRON is even exceeding the industry standard.

Standard industry packages

Ensuring the highest supply chain safety to the customer is one of the main targets for SEMIKRON. The development and successful introduction of industry standard packages reflects that strategy. With SEMITOP E1/E2, SEMiX5, SEMiX3 Press-Fit and SEMITRANS10 five different power module packages are available, fully pin-compatible with the market standards.

Multiple Source Key Features

  • Highest supply chain safety through wide range of standard industry packages
  • Second source IGBT and free-wheeling diode chips are available in all voltage classes

Exceeding the standard...

  • ...by smart integration of functionality at no extra space into the package
  • ...thanks to optimisation in the internal power module design

Chip flexibility

Supply chain safety and 2nd source does not only apply to the package itself, but of course to its individual components as well. Therefore SEMIKRON introduces a second source of IGBT chips with Vishay 650V chips, 1200V/1700V from Renesas, beside the already introduced Infineon, ABB and Fuji IGBTs. SEMITRANS10 is the first module released with 2nd source IGBTs, SEMiX3 Press-Fit, SEMiX5 and SEMITRANS will follow successively. Also for the corresponding free-wheeling diodes other manufacturers are available in addition to the reliable SEMIKRON CAL diodes.

Exceeding the standard

SEMIKRON pays special attention to further increase the performance of the standard packages. The SEMiX3 Press-Fit is available with current sensing integrated and plug-and-play driver ensuring fastest time-to market. It lowers the system cost by integrating the current measurement into the power module requiring no extra space. SEMiX5 is optimised for heat spreading and thus lower thermal resistance. The stray inductance is the lowest in the market, allowing the switching of higher output currents with the same voltage overshoot on chip level.