IGBT and rectifier module family for solder-free mounting
The half-bridge topologies offer a selection of choices for connection technologies, such as press-fit and spring contact, as well as integration levels. For instance, operational features include current measurement shunts within the power module, plug & play driver solutions and pre-printed Phase Change Material. Shorten time-to-market and development times with these options.
The SEMiX family includes uniform IGBT and rectifier housings. All have the same height (17mm) and can be connected by one principle DC-link design. This saves development time and makes a simple, low inductance DC-link profile possible. Spring or press-fit contacts allow for a gate driver mounted directly on top of the module, eliminating the risk of noise on wires or loose connectors. Highly compact, state-of-the-art inverter designs are possible thanks to the flat package and separate AC and DC terminals. Avoid solder joints, use highly reliable spring and press-fit contacts for auxiliary terminals, which offers increased product reliability and lifetime.
The solder-free contacts make for quick and easy assembly. Optimize inverter production with a uniform assembly direction (everything top down). This simplifies logistics and reduces manufacturing costs.
SEMiX® Product Family
The SEMiX Spring package covers SEMiX 1 to SEMiX 33 in the proven 17mm module with SPRiNG contacts for auxiliary connections. SEMiX Spring modules are available in half-bridge, 6-pack or chopper topology and allow a flat and compact inverter design.
SEMiX® 3 Press-Fit
The SEMiX 3 Press-Fit package combines the proven SEMiX with the fast and easy assembly using Press-Fit technology. SEMiX 3 Press-Fit is also available with integrated shunt resistors for AC current measurement.
SEMiX 5 Press-Fit is a compact, baseplate power module with optimized AC and DC screw connections. Press-Fit technology allows a solder-free gate driver mounting. The SEMiX 5 Press-Fit is also available for NPC and T-NPC 3-level applications.
SEMiX 6 features state-of-the-art press-fit pin technology for the power and auxiliary terminals. Employing solder-free mounting technology, the 17mm high SEMiX product family maximizes the efficiency of the mounting processes.
SEMiX® Short Facts
- Low stray inductance case
- Reliable spring and press-fit connections
- Flat and compact inverter design
SEMiX® Key Features
- Half-bridge, chopper, sixpack and 3-level topologies
- Isolated copper baseplate using DBC technology
- Also available with integrated shunt resistor (SEMiX 3 Press-fit)
- Multiple IGBT sources
SEMiX is a flexible and application-oriented module. On the basis of a scalable platform concept, modern chip technology is integrated into IGBT and rectifier modules which are used in a wide variety of applications, such as AC motor drives, switching power supplies and current source inverters. Other typical applications include uninterruptible power supplies, photovoltaic systems, wind energy and automotive applications.
SEMiX® Product Range
SEMiX IGBT modules are available in 600V, 1200V and 1700V. Half-bridge, sixpack and chopper topologies are available with a current range from 75A to 700A. Besides IGBT3 and IGBT4 chips, the 1200V range also includes a series with V-IGBT devices and the latest M7 technology. Controlled, half-controlled and uncontrolled rectifier modules with identical footprint are also available. For the latest housing versions, we also offer optional integrated shunt resistors and 3-level topologies (NPC, TNPC or Buck/Boost topologies from 150A to 400A).
|SEMiX 3 Spring||up to 350kW|
|SEMiX 3 Press-Fit||up to 400kW|
|SEMiX 5||up to 500kW|
|SEMiX 6 Press-Fit||up to 75kW|