Thermal Interface Materials
Modules with pre-applied thermal interface materials
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- Product Type
- TiM
material - Weight in mg
- Thickness (after assembly) in µm
- Tolerances (+/-) in µm
- Product Status
- Wacker P12-216In production
- Wacker P12-216In production
- Wacker P12-3310In production
- Wacker P12-3010In production
- Wacker P12-5010In production
- Wacker P12-5510In production
- Wacker P12-4510In production
- Wacker P12-4010In production
- Wacker P12-356In production
- Wacker P12-356In production
- Wacker P12-6010In production
- Wacker P12-6010In production
- Wacker P12-297In production
- Wacker P12-477In production
- Wacker P12-316In production
- Wacker P12-446In production
- Electrolube HTC-7510In production
- Electrolube HTC-6010In production
- HALA TPC-Z-PC-P8250--In production new
- HALA TPC-Z-PC-P8270--In production new
- HALA TPC-Z-PC-P8170--In production new
- HALA TPC-Z-PC-P8160--In production new
- HALA TPC-Z-PC-P8280--In production new
- HALA TPC-Z-PC-P8440--In production new
- High Performance Thermal Paste695--In production new
- High Performance Thermal Paste1015--In production new
- High Performance Thermal Paste810--In production new
- High Performance Thermal Paste605--In production
- High Performance Thermal Paste170--In production new
- High Performance Thermal Paste390--In production new
- High Performance Thermal Paste190--In production new
- High Performance Thermal Paste350-6In production new
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Optimized thickness, easy mounting, long term reliability
SEMIKRON was the first power module manufacturer on the market who offered power modules with pre-applied thermal interface material. With more than two decades of field experience and more than ten million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silk screen and stencil printing line.
Based on different application requirements and different environmental conditions, SEMIKRON offers a broad range of thermal interface materials. Additionally to a standard silicone based and a silicon free thermal grease, a phase change material and the new high performance thermal paste with an improved thermal performance are available. SEMIKRON formulated a clear strategy that phase change materials will be applied on modules with baseplates only and thermal greases on modules without a baseplate.