SEMITOP – Flexibility for high integration level and high performances

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SEMITOP^® Benefits

The SEMITOP platform centers around 12-mm-high modules, covering the low and medium-power range, with one or two mounting screws and no baseplate, featuring PCB interface via solder or press-fit pins. The low commutation inductance design and the choice of the latest Si and SiC chip technologies make this product suitable for UPS and solar applications, motor drives, power supplies, welding and the new EV battery charger market. A large variety of configurations is possible within the SEMITOP family, including 3-level (NPC/TNPC) and CIB (converter-inverter-brake) topologies.

SEMITOP^® Product Family

SEMITOP^® 1-4

Complete 12mm module-family with PCB connection via solder or press-fit pins. Low commutation inductance design and the availability of latest Si and SiC chip technologies brings maximum performance in its class.

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SEMITOP^® E1/E2

SEMITOP E1 and E2 have been developed to offer an alternative to the consolidated standard industrial packages in order to ensure customers’ supply chain safety at the same high performance levels.

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SEMITOP^® Short Facts

12mm module height
Reliable solder or press-fit connection
Low stray inductance case
Optimised thermal performance

SEMITOP^® Key Features

No baseplate
Complex configurations possible
Different chip technologies and manufacturers available
Optmised system costs

SEMITOP^® Applications

The SEMITOP family features a cost effective design. This product generation is designed for the low and medium power range of up to 200kW following the latest introduction of the SEMITOP E family. The scope this gives for compact and low inductance designs, coupled with the latest chip technologies and different topologies, makes the two platforms suitable for different markets such as UPS, solar, motor drives, power supplies and the new, emerging EV battery charger market.

SEMITOP^® Product Range

SEMITOP can include fast Si diodes, fast IGBTs 650V/1200V class and MOSFETs even for high voltage. Even the latest SiC chip technologies for diodes and MOSFETs can be integrated in the platform, making a lot of different configurations with different chip combinations possible:

Neutral point clamp 3-level configuration (NPC)
T-type NPC 3-level configuration (TNPC)
3-phase inverter (Sixpack)
CIB configurations (converter-inverter-brake)
3-phase bridge rectifier
Full SiC and hybrid configurations
Customised configurations possible