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Thermal Interface Materials at a Glance

SEMIKRON was the first power module manufacturer on the market to offer power modules with a pre applied Thermal Interface Material. With more than 2 decades of field experience and more than 10 million pre-printed modules in the field, new reliability benchmarks are being set.

Given the numerous application requirements and a multitude of environmental conditions, SEMIKRON offers a wide range of Thermal Interface Materials. In addition to the standard silicone and silicone-free thermal greases, a Phase Change Material and a new High Performance Thermal Paste with improved thermal performance are now also available.

Following extensive research and testing, SEMIKRON made a clear decision that Phase Change Materials will be applied on modules with baseplates only, with thermal greases being used on modules without baseplates. Phase Change Materials with a rigid consistency at room temperatures can fully exploit the advantages that a non-smearing TIM layer bring on baseplate modules without further drawbacks. Modules with no baseplate, on the other hand, require a low-viscosity material to help improve robustness during assembly. Here, thermal grease is the superior option.

Advantages of modules applied with SEMIKRON’s automated silk screen and stencil process

  • Increased productivity thanks to reduced handling costs and improved logistics
  • Low thermal resistance with an optimised TIM layer thickness
  • Improved lifetime and reliability
  • Improved assembly robustness
  • Modules can be shipped directly to the assembly line without any additional treatment
  • Lower overall costs in most cases
Thermal interface materials for modules with and without baseplates

High Performance Thermal Paste

Outstanding thermal performance and lifetime increase

Outstanding thermal performance and increased lifetime

High Performance Thermal Paste is the new SEMIKRON solution for boosting the performance of baseplate-less modules. The material is a silicone-based thermal grease with outstanding thermal conductivity. Replacing standard TIM materials with High Performance Thermal Paste results in either a lower chip temperature and therefore longer power module lifetime, or it allows for higher output currents in the given application. Any combination of both benefits, longer life time and higher output current is possible with small trade-offs.

A print layout individually developed for each module ensures high assembly robustness and means the client can always use the same assembly process irrespective of the type of thermal grease used.

Thermal Paste Key Features

  • Outstanding thermal performance
  • Up to 50% lower chip-to-heat sink thermal resistance than with standard TIM
  • Up to 25% more module output power or lifetime increases of as many as several decades
  • Fewer manufacturing processes and lower material costs
  • No need for expensive ceramic substrates such as aluminium nitride
  • Excellent assembly robustness for modules without a baseplate
  • Proven long-term reliability without pump-out

Phase Change Material

Baseplate bending for SEMiX Press-Fit

Easier handling due to a dry contact surface

Phase Change Material is available for baseplate modules only. The rigid and dry TIM layer ensures that any accidental touching does not lead to any damage in the print pattern. For each module package size, a specific print pattern layout is developed in accordance with the baseplate bending.

This layout ensures metal-to-metal contact between selected areas of the module baseplate and the heat sink. Only the cavities (baseplate bending and the heatsink roughness) are filled with thermal interface material. This approach has two main advantages:

  • Thermal resistance Rth(j-s) is optimised
  • No screw retightening required after first operation

Phase Change Material Key Features

  • Easy handling thanks to solid contact surfaces, no TIM layer smearing
  • Optimised thickness for minimum thermal resistance
  • No screw retightening required after first operation
  • Up to 15% lower chip-to-heat sink thermal resistance than with standard TIM

Thermal Interface Materials

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Thermal Grease Phase Change Material
Module familiy Silicon-based
Standard Grease
Silicone-free
Standard Grease
High Performance Thermal
Paste, HPTP (silicone
-based)
MiniSKiiP 1 X available on request X -
MiniSKiiP 2 X X X -
MiniSKiiP 3 X X X -
MiniSKiiP 2 Dual X available on request X -
MiniSKiiP 3 Dual X available on request X -
MiniSKiiP 8 X available on request X -
SKiM 63/93 X available on request X -
SKiM 4 X available on request X -
SEMITOP 3/4 X available on request X -
SEMiTOP E2 x available on request X -
SEMiX 3s - - - X
SEMiX 13 - - - X
SEMiX Press-Fit - - - X
SEMiX 5 - - - X
SEMITRANS 3 - - - X
SEMITRANS 10 - - - X