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Thermal Interface Materials at a Glance

SEMIKRON was the first power module manufacturer on the market who offered power modules with a pre-applied Thermal Interface Material. With more than 2 decades of field experience and more than 10 million pre-printed modules in the field, new reliability benchmarks are being set.

With consideration to numerous application requirements and a multitude of environmental conditions, SEMIKRON offers a broad range of Thermal Interface Materials. Beside the standard silicone and a silicon free thermal greases, a Phase Change Material and the new High Performance Thermal Paste with improved thermal performance are now available. SEMIKRON researched and after extensive testing, made a clear decision that Phase Change Materials will be applied only on modules with baseplates, and thermal greases on modules without baseplates. Phase Change Material with a rigid consistency at room temperatures can fully exploit its advantages of a not smearable TIM layer on baseplate modules without additional drawbacks. On the contrary the baseplate-less module technology requires a low viscosity material to support high mounting robustness during assembly. Here, thermal grease is the superior option.

Advantages of modules applied with SEMIKRON’s automated silk screen and stencil process

  • Increased productivity due to reduced handling costs and logistics
  • Low thermal resistance with an optimised TIM layer thickness
  • Improved lifetime and reliability
  • High mounting robustness during assembly
  • Modules can be shipped directly to the assembly line without any additional treatment
  • Lower overall costs in most cases
Thermal interface materials for modules with and without baseplates

High Performance Thermal Paste

Outstanding thermal performance and lifetime increase

Outstanding thermal performance and lifetime increase

High Performance Thermal Paste is the new SEMIKRON solution to boost the performance of baseplate-less modules. The material is a silicon based thermal grease with outstanding thermal conductivity. Replacement of standard TIM materials with High Performance Thermal Paste results in either a lower chip temperature and therefore longer lifetime the power module, or it enables a higher output current in the application. Any combination of both benefits, longer life time and higher output current is possible with small trade-offs. A print layout individually developed for each module ensures high mounting robustness and allows to client to always use the same mounting procedure, independent from the thermal grease type used.

Thermal Paste Key Features

  • Outstanding thermal performances
  • Reduction of thermal resistance chip to heat sink by up to 50% when compared to standard TIM
  • Up to 25% more module output power or significant lifetime increases, up to several decades
  • Easy handling due to solid contact surfaces, no TIM layer smearing
  • Optimised thickness for lowest thermal resistance
  • Fewer manufacturing processes and lower material costs
  • Eliminates the need of expensive ceramic substrates like aluminium nitride
  • Excellent mounting robustness for modules without a baseplate

Phase Change Material

Baseplate bending for SEMiX Press-Fit

Easier handling due to a dry contact surface

Phase Change Material is offered on baseplate modules only. The rigid and dry TIM layer ensures that any accidental touching does not lead to any damage of the print pattern. For each module package size, a specific print pattern layout is developed according to the baseplate bending. This layout ensures metal-to-metal contact of selected areas of the module baseplate to the heat sink. Only the cavities (baseplate bending and the heatsink roughness) will be filled out with thermal interface material. This approach provides two main advantages:

  • Thermal resistance Rth(j-s) is optimised
  • No screw retightening required after first operation

Phase Change Material Key Features

  • Easy handling due to solid contact surfaces, no TIM layer smearing
  • Optimised thickness for lowest thermal resistance
  • No module retightening required after first operation
  • Reduction of thermal resistance chip to heat sink by up to 15% when compared to standard TIM

Thermal Interface Materials Product Portfolio

Silicone based and silicone free thermal paste materials are available for a broad range of products. Phase change material will be offered for a selected range of baseplate modules first and then expanded gradually. Module types offered with preapplied thermal interface material are MiniSKiiP, SKiM, SEMITOP and SEMiX Press-Fit. Power modules with pre-applied phase change material like SEMiX and SEMITRANS are added gradually.

Thermal Interface Materials

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Thermal Grease Phase Change Material
Module familiy Standard Grease
silicone based
Standard Grease
silicone free
High Performance Thermal
Paste, HPTP (silicone based)
MiniSKiiP 1 X available on request coming soon -
MiniSKiiP 2 X X X -
MiniSKiiP 3 X X X -
MiniSKiiP 2 Dual X available on request coming soon -
MiniSKiiP 3 Dual X available on request coming soon -
MiniSKiiP 8 X available on request X -
SKiM 63/93 X available on request X -
SKiM 4 X available on request coming soon -
SEMITOP 3/4 X available on request coming soon -
SEMiX 1s - - - X
SEMiX 3s - - - X
SEMiX 13 - - - X
SEMiX Press-Fit - - - X
SEMiX 5 - - - X
SEMITRANS 3 - - - coming soon
SEMITRANS 10 - - - coming soon