TP(HPTP)Mini3GB

Thermal Interface Materials
MiniSKiiP II 3

Part Number 12281125
TiM
material
High Performance Thermal Paste
Weight in mg 490
Thickness (after assembly) in µm -
Tolerances (+/-) in µm -
Product Status In production

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SEMIKRON MiniSKiiP II 3
SEMIKRON inhomog. honeycomb structure

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TP(HPTP)Mini3GB Features

• New high performance thermal paste

• Superior heat dissipation

• Inhomogeneous honeycomb structure

• Optimized thickness of thermal paste

layer

• High process reliability due to

automated screen printing process

TP(HPTP)Mini3GB Target Applications

Additional Searches

TP(HPTP)Mini 3GB, TP(HPTP)Mini3 GB, TPHPTPMini3 GB, TPHPTPMini 3GB, TPHPTPMini3GB