SEMiX® 6
The complete press-fit standard
The Industry Standard for Reliable Connection Technology
SEMiX 6 features state-of-the-art press-fit pin technology for both power and auxiliary terminals. With solder-free mounting technology, the 17-mm-high SEMiX 6 maximizes production efficiency. With the SEMiX 6, connect all terminals in a single production step.
SEMiX® 6 Benefits
The SEMiX 6 platform offers a scalable, flexible solution for high-performance inverter architectures. The press-fit design ensures full compatibility to the market standard, yet optimized for gentle and reliable PCB assembly.
Reduce inverter assembly cost and reach 100% process control using press-fit technology for all the terminals, for auxiliary and power connection. Junction temperatures up to 175°C allows far superior performance than comparable solutions on the market. This improved performance combined with our design for minimum power losses is ideal for achieving compact inverter systems on a single PCB basis.
SEMiX® 6 Key Features
- Fully compatible with industry standard
- Solder-free assembly
- 17 mm in height
- Press-fit technology for auxiliary and power terminals
- Baseplate solution
- Flexible platform for custom designs
SEMiX® 6 Applications
This tested package features a robust baseplate solution combined with a full press-fit concept for all electric terminals, creating a competitive platform for PCB-based inverter solutions. The package is suitable for a broad range of applications, including:
- AC inverter drives
- UPS systems
- Renewable energy systems
SEMiX® 6 Product Range
SEMiX 6 features 7th generation IGBTs for lower costs thanks to higher current density. The rectifier portfolio introduces our new SKR PEP up to 2200V and 160kW. This is the perfect match for the IGBT sixpacks in the same package, equipped with the latest IGBT chip technology in 650V, 1200V and 1700V. The CIBs round off the portfolio in 650V, 1200V and 1700V.
The Industry Standard for Reliable Connection Technology
Press-fit technology for reliable, solder-free mounting
- Fast mechanical connection in cold welding process
- Direct elastic connection with defined parameters and high electrical conductivity
- Thermal material expansion is absorbed elastically by each individual connection
- All the contacts to the PCB connected in just 0.1s
- Reliable and controlled press-fit connection
For compact designs and optimized process costs
- Efficient, easy to automate production process
- Low inductance connection with DC link capacitors
- Simpler logistics and fewer parts
- Simple ISO coordination
- Compact system design
SEMiX® 6 Product Portfolio
SEMiX 6: 122.0mm x 62.0mm x 17.0mm (L x W x H)
| Rectifier | |||
|---|---|---|---|
| Type Designation | Topology | VRRM in [V] | ID in [A] |
| SEMiX636D16p | B6U | 1600 | 700 |
| SEMiX586D16p | B6U | 1600 | 700 |
| SEMiX526D22p | B6U | 2200 | 650 |
| SEMiX126DGL22p | B6U + Chopper | 2200 | 400 |
| SEMiX186DGL16p | B6U + Chopper | 1600 | 400 |
| IGBT Modules | |||
|---|---|---|---|
| Type Designation | Topology | VCES in [V] | ICnom in [A] |
| SEMiX106GD12T4p | Sixpack | 1200 | 100 |
| SEMiX156GD12T4p | Sixpack | 1200 | 150 |
| SEMiX206GD12T4p | Sixpack | 1200 | 200 |
| SEMiX106GD12M7p | Sixpack | 1200 | 100 |
| SEMiX156GD12M7p | Sixpack | 1200 | 150 |
| SEMiX206GD12M7p | Sixpack | 1200 | 200 |
| SEMiX256GD12M7p | Sixpack | 1200 | 250 |
| SEMiX076DGDL12M7p | CIB | 1200 | 75 |
| SEMiX106DGDL12M7p | CIB | 1200 | 100 |
| SEMiX156DGDL12M7p | CIB | 1200 | 150 |
| SEMiX206DGDL12M7p | CIB | 1200 | 200 |
SEMiX® 6 IGBT Modules
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SEMiX® 6 Full SiC Modules
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SEMiX® 6 Hybrid-SiC Modules
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SEMiX® 6 MOSFET Modules
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