Power Electronics for
Our solutions for your UPS system
Power Electronics for UPS Systems
The availability of infrastructure systems strongly depends on reliable power supplies, irrespective of whether these systems are servers and cloud storage systems, critical traffic control, hospital services or other essential supply systems.
Uninterruptable Power Supplies (UPS) ensure continuous operation of these critical systems. In SEMIKRON power modules, flexible topologies equipped with the latest IGBT and diode chips ensure maximum conversion efficiency for online double conversion UPS systems. This efficiency can be further improved using Silicon Carbide technology.
Compact and Efficient 100kVA Systems
UPS solutions for data centres today are based on modular UPS systems. In these systems several independent UPS modules in 19’’ frames are paralleled with single modules up to 100kVA. This achieves high scalability and easy implementation of redundancy.
The MiniSKiiP UPS power modules are available as symmetrical boost for the input stage and 3-level NPC topology for the output side. Both are based on fast swiching 650V IGBTs to allow high switching frequency and high efficiency at the same time, up to 100kVA output power. Optional Silicon Carbide components can increase efficiency even further.
Most Comprehensive UPS Portfolio
Highest UPS Power Density with SEMiX 5
With its comprehensive portfolio and its optimized design, the SEMiX 5 is ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. An adapter board for easy gate drive integration is also available.
The internal chip layout is optimized for enhanced thermal performance, reducing operating temperatures and thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.
High power density thanks to comprehensive portfolio
SEMiX® 5Extended standard for superior thermal and dynamic performance
MiniSKiiP®Solder-free spring technology for minimum assembly time
SEMIPACK®Bipolar modules from the market leader
SEMITOP® E1/E2Exceeding the standard for superior performance
SEMiX® 3 Press-FitExceeding the standard for superior performance
SEMITRANS®The proven power electronics package
SEMITRANS® 10Robust high power module
SEMITRANS® 20The new standard in high power
Intelligent Power Modules – IPMs
The Most Powerful IPM in the Market
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air or water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.
The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.
To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
- 1200V and 1700V
- Half-bridges and sixpacks
- 1800A to 3600A
- Flexible cooling options: air, water or customized cooling options
- Paralleled operation for even higher output power possible
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
SEMIKRON’s Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.More about Power Electronic Stack
In addition to standard stacks, SEMIKRON has vast experience in developing customer-specific solutions. Engineers are available in our stack centres around the globe to offer such solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global SEMIKRON stack production footprint
- Highly experienced engineering team
Product Portfolio IGBT Driver
Above the Standard
SEMIKRON’s unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.
SEMIKRON’s IGBT drivers are available as two- channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.
Achieve outstanding system compactness and create space-and cost-effective inverter designs with SEMIKRON’s drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.
More than 25 years of experience in developing innovative IGBT driver electronics enables SEMIKRON to have a short-term solution for almost every challenge related to driver electronics. SEMIKRON’s Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with SEMIKRON’s adapter boards or application sample PCBs. For the latter, SEMIKRON shares the entire manufacturing data to decrease development time, speeding up the time-to-market.
SEMIKRON’s SKYPER and SKHI are well known, highly robust and reliable IGBT driver solutions under demanding environmental conditions.
Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.
- Reinforced insulation for signal and power transmission
- Two-channel driver
- Up to 1700V transients
- Up to 1500V continuous DC bus voltage
- 8Apk to 35Apk per channel
- 1W to 4.2W peak per channel
- Suitable for multi-level topologies and Generation 7 IGBT
Adapter Boards and Application Samples
Thermal Interface Materials
Stay Cool – Heat Dissipation is Our Job
SEMIKRON was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material. With more than two decades of field experience and more than 17 million pre-printed modules in the field, benchmarks are being set. The modules with pre-applied TIM are printed in a clean environment on an automated and SPC controlled silkscreen and stencil printing line.
For each requirement, SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, phase change materials and high performance thermal paste with improved thermal performance are also available.
SEMIKRON offers either thermal grease or phase change materials depending on customer requirements (e.g. performance increase, reduced handling effort) and module type (with or without baseplate). Phase change materials have a solid consistency at room temperature, fully exploiting the advantages a non-smearing TIM layer offers, with no drawbacks. Baseplate-less modules, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.
- Increased productivity thanks to reduced handling costs and improved logistics
- Low thermal resistance with optimized TIM layer thickness
- Improved lifetime and reliability
- Improved assembly robustness
- Modules can be shipped directly to the assembly line without any additional treatment processes
- Lower overall costs